Cerahelix Ceramic Nanofiltration
Welcome to Cerahelix ceramic membranes – the next generation in ceramic nanofiltration.
Engineered with Cerahelix’s disruptive technology, our NanoHelix™ and PicoHelix™ membranes are leading a revolution in ceramic nanofiltration. Their ability to achieve nanofiltration opens the door to a myriad of applications for which traditional ceramic membrane technology is not well suited.
Cerahelix membranes take ceramic filtration and separation technology a step further, building on the inherently robust and durable nature that makes ceramics an outstanding choice in harsh operating environments. We employ a patented process using DNA and a proprietary ceramic film technology to create extremely uniform and smooth nanopores in our membranes.
Cerahelix membranes provide significant benefits over legacy polymeric technology that is often used in nanofiltration. Cerahelix membranes eliminate many of the challenges associated with their polymeric competitors: they do not require pre-treatment, they are resistant to fouling and can be cleaned rapidly and efficiently. By eliminating the need for pre-treatment stages, Cerahelix ceramic nanofiltration helps simplify system design and reduce the physical footprint. The net result is lower capital and operational costs for our clients.
Cerahelix membranes represent a new class of ceramic filtration and separations technology. Cerahelix membranes provide a robust, reliable and cost-effective solution for filtration, treatment and separation needs. They offer substantial benefits over competing technologies including lower operational costs, higher separation efficiency and minimal fouling. They also eliminate the need for expensive pretreatment.
Our proprietary membrane technology provides molecular level separation resulting in the removal of a wide range of organic and inorganic constituents with a high degree of efficiency. Our NanoHelix™ and PicoHelix™ membranes are engineered with proprietary technologies, to meet filtration requirements with respective cutoffs of 700 Da to 400 Da.